铁氟龙, 氟橡胶, 铁氟龙FEP, PVDF法国阿科玛9000HD, ETFE日本旭硝子C-88AX, PFA美国杜邦340, PA66/F/PTFE美国液氮RFL-403, PA66/PTFE美国液氮RL-4040, POM/PTFE基础创新塑料KL004
Arlon® AD300 | |||
Polytetrafluoroethylene | |||
Glass Fiber | |||
Product Description: | |||
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. | |||
The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. | |||
Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability. | |||
General | |||
Filler / Reinforcement | Glass Fiber | ||
Features | Fast Molding Cycle | Good Dimensional Stability | |
Uses | Appliance Components | Electrical/Electronic Applications | |
Forms | Pellets | ||
Physical | Nominal Value | Unit | Test Method |
Specific Gravity | 2.40 | g/cm³ | ASTM D792A |
Water Absorption (23°C, 24 hr) | 0.070 | % | ASTM D570 |
Mechanical | Nominal Value | Unit | Test Method |
Tensile Modulus | ASTM D638 | ||
23°C 2 | 3560 | MPa | |
23°C 3 | 4870 | MPa | |
Flexural Modulus (23°C) | 3720 | MPa | ASTM D790 |
Compressive Modulus | 2520 | MPa | ASTM D695 |
Films | Nominal Value | Unit | Test Method |
Tensile Strength | ASTM D882 | ||
MD : Yield | 144 | MPa | |
TD : Yield | 119 | MPa | |
Peel Strength 4 | -2.5 | kN/m | Internal Method |
Thermal | Nominal Value | Unit | Test Method |
Thermal Conductivity (100°C) | 0.24 | W/m/K | ASTM C177 |
Coefficient of Linear Thermal Expansion | |||
X Axis : 0 to 100°C | 1.2E-5 | cm/cm/°C | Internal Method |
Y Axis : 0 to 100°C | 1.5E-5 | cm/cm/°C | Internal Method |
Z Axis : 0 to 100°C | 9.5E-5 | cm/cm/°C | |
Electrical | Nominal Value | Unit | Test Method |
Surface Resistivity | 4.5E+7 | ohms | Internal Method |
Volume Resistivity | 1.2E+15 | ohms·cm | Internal Method |
Dielectric Constant (23°C) | 3.00 | Internal Method | |
Dissipation Factor (10.0 GHz) | 3.0E-3 | Internal Method | |
Arc Resistance | > 180 | sec | ASTM D495 |
Flammability | Nominal Value | Unit | Test Method |
Flame Rating | V-0 | UL 94 | |
Additional Information | Nominal Value | Unit | Test Method |
Breakdown Voltage | > 45000 | V | ASTM D149 |
2TD | |||
3MD | |||
4After Thermal Stress |
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