Arlon® 25N

2018-09-08 18:02:45

Arlon® 25N
Polytetrafluoroethylene
Ceramic Fiber; Glass Fiber
Product Description:
Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.

The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.

Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

General
Filler / Reinforcement	Ceramic Fiber	Glass Fiber

Features	Fast Molding Cycle	Good Dimensional Stability

Uses	Electrical/Electronic Applications

Forms	Pellets

Arlon&reg; 25N